Quantum Computing, Inc. Announces Strategic Partnerships and Pre-Orders Ahead of 2025 Quantum Photonic Chip Foundry Opening
Quantum Computing Inc. (QUBT) announces significant progress towards its quantum photonic chip foundry opening in Q1 2025. The company has launched a pilot program for thin film lithium niobate (TFLN) foundry services and secured two strategic MOUs: one with Spark Photonics Design for evaluation chip kits, and another with Alcyon Photonics for process design kits development. QCi is currently in negotiations with potential customers across North America, Europe, and Asia, expecting to finalize multiple orders for TFLN electro-optical modulator chips by year-end. The foundry will operate a 150 mm wafer line with front-end and packaging capabilities.
Quantum Computing Inc. (QUBT) annuncia progressi significativi verso l'apertura della sua fabbrica di chip fotonici quantistici nel primo trimestre del 2025. L'azienda ha avviato un programma pilota per servizi di fabbrica di niobato di litio con film sottile (TFLN) e ha siglato due memorandum d'intesa strategici: uno con Spark Photonics Design per kit di chip da valutazione e l'altro con Alcyon Photonics per lo sviluppo di kit di progettazione del processo. QCi 猫 attualmente in trattative con potenziali clienti in Nord America, Europa e Asia, e si aspetta di finalizzare diversi ordini per chip modulatore elettro-ottici TFLN entro la fine dell'anno. La fabbrica funzioner脿 con una linea di wafer da 150 mm, dotata di capacit脿 di front-end e imballaggio.
Quantum Computing Inc. (QUBT) anuncia avances significativos hacia la apertura de su f谩brica de chips fot贸nicos cu谩nticos en el primer trimestre de 2025. La compa帽铆a ha lanzado un programa piloto para servicios de f谩brica de niobato de litio en pel铆cula delgada (TFLN) y ha asegurado dos memorandos de entendimiento estrat茅gicos: uno con Spark Photonics Design para kits de chips de evaluaci贸n y otro con Alcyon Photonics para el desarrollo de kits de dise帽o de procesos. QCi est谩 actualmente en negociaciones con clientes potenciales en Am茅rica del Norte, Europa y Asia, con la expectativa de finalizar m煤ltiples pedidos de chips moduladores electro-贸pticos TFLN para fin de a帽o. La f谩brica operar谩 una l铆nea de obleas de 150 mm con capacidades de front-end y empaquetado.
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Quantum Computing Inc. (QUBT) annonce des progr猫s significatifs vers l鈥檕uverture de sa fonderie de puces photoniques quantiques pr茅vue pour le premier trimestre de 2025. L鈥檈ntreprise a lanc茅 un programme pilote pour des services de fonderie de niobate de lithium en film mince (TFLN) et a s茅curis茅 deux accords de partenariat strat茅giques : l鈥檜n avec Spark Photonics Design pour des kits de puces d鈥櫭﹙aluation et l鈥檃utre avec Alcyon Photonics pour le d茅veloppement de kits de conception de processus. QCi est actuellement en n茅gociations avec des clients potentiels en Am茅rique du Nord, en Europe et en Asie, et s鈥檃ttend 脿 finaliser plusieurs commandes de puces modulateurs 茅lectro-optiques TFLN d鈥檌ci la fin de l鈥檃nn茅e. La fonderie fonctionnera avec une ligne de wafers de 150 mm, dot茅e de capacit茅s de front-end et d'emballage.
Quantum Computing Inc. (QUBT) gibt bedeutende Fortschritte in Richtung Er枚ffnung seines Quanten-Photonik-Chip-Werks im ersten Quartal 2025 bekannt. Das Unternehmen hat ein Pilotprogramm f眉r D眉nnfilm-Lithium-Niobat (TFLN) Werkstattdienstleistungen gestartet und zwei strategische Memoranden of Understanding (MoUs) unterzeichnet: eines mit Spark Photonics Design f眉r Evaluierungs-Chip-Kits und ein weiteres mit Alcyon Photonics zur Entwicklung von Prozessdesign-Kits. QCi befindet sich derzeit in Verhandlungen mit potenziellen Kunden in Nordamerika, Europa und Asien und erwartet, bis zum Jahresende mehrere Bestellungen f眉r TFLN elektro-optische Modulatorchips abzuschlie脽en. Das Werk wird eine 150-mm-Wafer-Linie mit Front-End- und Verpackungsf盲higkeiten betreiben.
- Secured two strategic MOUs with Spark Photonics Design and Alcyon Photonics
- Advanced negotiations for multiple TFLN chip orders across three continents
- On track for Q1 2025 foundry opening with 150 mm wafer line capabilities
- Technology recognized as a 'hot topic' for 2025 by NVIDIA
- No current revenue from foundry operations as facility is not yet operational
- Significant capital expenditure required for foundry construction and equipment installation
Insights
The announcement represents a significant strategic positioning in the quantum computing and photonics sector. The establishment of MOUs with Spark Photonics Design and Alcyon Photonics creates a robust foundation for QCi's TFLN foundry services launch in Q1 2025. The partnerships strategically address both technical development and market access needs.
The focus on thin film lithium niobate (TFLN) technology is particularly noteworthy, as it's been identified as a key growth area by industry leader NVIDIA. The technology's potential for energy efficiency and performance improvements in quantum computing, AI and data center connectivity positions QCi well in multiple high-growth markets.
However, investors should note that while pre-orders and partnerships are promising indicators, the company's
Led by Drs. Pouya Dianat and Milan Begliarbekov, QCi has made substantial strides in driving commercial activities for its products and PIC foundry services. These ongoing activities have led to the Company's engagement in contract and technical negotiations with several key partners and customers across
In line with its long-term goals for strategic collaboration聽in PIC design, manufacturing, testing, and packaging, QCi has executed two memorandums of understanding (MOUs) with prominent partners. The first MOU has been established with Spark Photonics Design, Inc., a leading
Additionally, QCi has established a second MOU with Alcyon Photonics, a European-based photonics design company. Together, these partnerships represent a significant advancement for QCi in facilitating the development of process design kits (PDKs) and design services, reinforcing the Company's commitment to achieve global reach with customers utilizing its TFLN fab line.
"The early engagement from strategic partners and customers, such as these, underscores our confidence in the strong growth potential for our photonic chips and highlights the global market interest in the TFLN capabilities of our foundry," stated Dr. William McGann, Chief Executive Officer (CEO) of QCi. "This positive response reflects the increasing market demand for TFLN technology, which promises substantial performance advantages and energy cost savings across applications in photonic-based quantum computing, defense, artificial intelligence (AI), and data center connectivity and optical interconnects."
This announcement follows the recent of the QCi Foundry and its services during Dr. Dianat's presentation at the Optica Photonic-Enabled Cloud Computing (PECC) Industry Summit. The event showcased the promising future of TFLN technology, which has been recognized as a "hot topic" for 2025 by NVIDIA, further emphasizing its growth potential in the telecom and datacom landscape.
As QCi approaches the final phase of construction and capital equipment installation for its foundry, the Company continues to engage with various customers to build strategic partnerships and capture pre-orders. The QCi Foundry, which is anticipated to be fully operational in early 2025, will have both front end and packaging capabilities for a 150 mm wafer line, as well as the ability to design, simulate, and characterize optoelectronic devices.
For more information about QCi's Foundry or to discuss collaboration opportunities with QCi and its foundry services, please visit the QCi Foundry .
About Quantum Computing Inc.
聽("QCi" or the "Company") (Nasdaq: QUBT) is an innovative, integrated photonics and quantum optics technology company that provides accessible and affordable quantum machines to the world today. QCi products are designed to operate at room temperature and low power at an affordable cost. The Company's portfolio of core technology and products offer unique capabilities in the areas of high-performance computing, artificial intelligence, cybersecurity, as well as remote sensing applications.
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