Micron Breaks Ground on New HBM Advanced Packaging Facility in Singapore
Micron Technology (MU) has broken ground on a new High-Bandwidth Memory (HBM) advanced packaging facility in Singapore, representing an investment of approximately $7 billion through the end of the decade. The facility, the first of its kind in Singapore, is scheduled to begin operations in 2026, with significant capacity expansion planned for 2027 to meet growing AI demands.
The investment will initially create 1,400 jobs, with plans to expand to 3,000 positions, including roles in packaging development, assembly, and test operations. The facility will strengthen Singapore's semiconductor ecosystem and feature sustainable technologies including greenhouse gas abatement, water recycling, and waste circularity measures. The building will be highly automated with AI-based solutions and designed to meet LEED certification requirements.
Additionally, Micron plans to support long-term NAND manufacturing requirements in Singapore, with flexibility in managing capacity ramps for both HBM and NAND facilities based on market demand.
Micron Technology (MU) ha avviato la costruzione di una nuova struttura per il packaging avanzato della High-Bandwidth Memory (HBM) a Singapore, rappresentando un investimento di circa 7 miliardi di dollari entro la fine del decennio. L'impianto, il primo del suo genere a Singapore, 猫 previsto che inizi le operazioni nel 2026, con un significativo ampliamento della capacit脿 programmato per il 2027 per soddisfare la crescente domanda dell'AI.
L'investimento creer脿 inizialmente 1.400 posti di lavoro, con piani di espansione fino a 3.000 posizioni, comprese funzioni nello sviluppo del packaging, nell'assemblaggio e nelle operazioni di test. La struttura rafforzer脿 l'ecosistema dei semiconduttori di Singapore e presenter脿 tecnologie sostenibili, inclusi misure di riduzione dei gas serra, riciclo dell'acqua e circolarit脿 dei rifiuti. L'edificio sar脿 altamente automatizzato con soluzioni basate sull'AI e progettato per soddisfare i requisiti di certificazione LEED.
Inoltre, Micron prevede di supportare i requisiti a lungo termine della produzione di NAND a Singapore, con flessibilit脿 nella gestione degli aumenti di capacit脿 sia per gli impianti HBM che NAND in base alla domanda di mercato.
Micron Technology (MU) ha comenzado la construcci贸n de una nueva instalaci贸n de empaque avanzado para memoria de alta capacidad (HBM) en Singapur, representando una inversi贸n de aproximadamente 7 mil millones de d贸lares hasta finales de la d茅cada. La instalaci贸n, la primera de su tipo en Singapur, tiene prevista su operaci贸n para 2026, con una expansi贸n significativa de capacidad programada para 2027 para satisfacer la creciente demanda de IA.
La inversi贸n inicialmente crear谩 1,400 empleos, con planes de expandirse a 3,000 puestos, incluidos roles en desarrollo de empaque, ensamblaje y operaciones de prueba. La instalaci贸n fortalecer谩 el ecosistema de semiconductores de Singapur y contar谩 con tecnolog铆as sostenibles que incluyen la reducci贸n de gases de efecto invernadero, reciclaje de agua y medidas de circularidad de desechos. El edificio ser谩 altamente automatizado con soluciones basadas en IA y dise帽ado para cumplir con los requisitos de certificaci贸n LEED.
Adem谩s, Micron planea apoyar los requisitos de fabricaci贸n de NAND a largo plazo en Singapur, con flexibilidad para gestionar incrementos de capacidad tanto para las instalaciones de HBM como para las de NAND seg煤n la demanda del mercado.
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鞚� 韴瀽搿� 齑堦赴鞐愲姅 1,400臧滌潣 鞚检瀽毽�臧� 彀届稖霅橂┌, 頄ロ泟 3,000臧滌潣 鞚检瀽毽 頇曤寑頃� 瓿勴殟鞛呺媹雼�. 鞚挫棎電� 韺偆歆� 臧滊皽, 臁半 氚� 韰岇姢韸� 鞖挫榿 攵勳暭臧� 韽暔霅╇媹雼�. 鞚� 鞁滌劋鞚� 鞁标皜韽ゴ鞚� 氚橂弰觳� 靸濏儨瓿勲ゼ 臧曧檾頃橁碃 鞓嫟臧�鞀� 鞝�臧�, 氍� 鞛櫆鞖� 氚� 韽愱赴氍� 靾滍櫂 臁办箻毳� 韽暔頃� 歆�靻� 臧�電ロ暅 旮办垹鞚� 韸轨鞙茧 頃╇媹雼�. 鞚� 瓯措鞚� AI 旮半皹 靻旊（靺橃溂搿� 瓿犽弰搿� 鞛愲彊頇旊悩氅� LEED 鞚胳 鞖旉惮 靷暛鞚� 於╈”頃橂弰搿� 靹り硠霅� 瓴冹瀰雼堧嫟.
霕愴暅 毵堨澊韥鞚� 鞁标皜韽ゴ鞐愳劀 鞛リ赴鞝侅澑 NAND 鞝滌“ 鞖旉惮 靷暛鞚� 歆�鞗愴暊 瓿勴殟鞚措┌, 鞁滌灔 靾橃殧鞐� 霐半澕 HBM 氚� NAND 鞁滌劋鞚� 鞖╇焿 歃濍寑 甏�毽ゼ 鞙犾棸頃橁矊 鞖挫榿頃� 瓴冹瀰雼堧嫟.
Micron Technology (MU) a commenc茅 la construction d'une nouvelle installation d'emballage avanc茅 pour la m茅moire 脿 haute bande passante (HBM) 脿 Singapour, repr茅sentant un investissement d'environ 7 milliards de dollars d'ici la fin de la d茅cennie. L'installation, la premi猫re de son genre 脿 Singapour, devrait commencer ses op茅rations en 2026, avec une importante expansion de capacit茅 pr茅vue pour 2027 afin de r茅pondre 脿 la demande croissante en IA.
L'investissement cr茅era initialement 1.400 emplois, avec des projets d'expansion jusqu'脿 3.000 postes, y compris des r么les dans le d茅veloppement d'emballage, l'assemblage et les op茅rations de test. L'installation renforcera l'茅cosyst猫me des semi-conducteurs de Singapour et comportera des technologies durables, notamment des mesures de r茅duction des gaz 脿 effet de serre, de recyclage de l'eau et de circularit茅 des d茅chets. Le b芒timent sera hautement automatis茅 avec des solutions bas茅es sur l'IA et con莽u pour r茅pondre aux exigences de certification LEED.
De plus, Micron pr茅voit de soutenir les besoins de fabrication de NAND 脿 long terme 脿 Singapour, avec une flexibilit茅 dans la gestion des augmentations de capacit茅 pour les installations HBM et NAND en fonction de la demande du march茅.
Micron Technology (MU) hat den Bau einer neuen fortschrittlichen Verpackungsanlage f眉r High-Bandwidth Memory (HBM) in Singapur begonnen, was eine Investition von etwa 7 Milliarden US-Dollar bis zum Ende des Jahrzehnts darstellt. Die Anlage, die erste ihrer Art in Singapur, soll 2026 den Betrieb aufnehmen, mit einer erheblichen Kapazit盲tserweiterung, die f眉r 2027 geplant ist, um der wachsenden Nachfrage nach KI gerecht zu werden.
Die Investition wird zun盲chst 1.400 Arbeitspl盲tze schaffen, mit Pl盲nen zur Erweiterung auf 3.000 Positionen, einschlie脽lich Rollen in der Verpackungsentwicklung, Montage und Testbetrieb. Die Anlage wird das Halbleiter-脰kosystem Singapurs st盲rken und nachhaltige Technologien wie Treibhausgasminderung, Wasserr眉ckgewinnung und Abfallkreislaufma脽nahmen umfassen. Das Geb盲ude wird hochautomatisiert mit KI-basierten L枚sungen und wird so konzipiert, dass es die Anforderungen f眉r die LEED-Zertifizierung erf眉llt.
Zus盲tzlich plant Micron, die langfristigen NAND-Herstellungsanforderungen in Singapur zu unterst眉tzen, mit Flexibilit盲t in der Verwaltung des Kapazit盲tsausbaus sowohl f眉r HBM- als auch f眉r NAND-Anlagen in Abh盲ngigkeit von der Marktnachfrage.
- Major $7 billion investment in new HBM facility targeting growing AI market demand
- Creation of 1,400 initial jobs, expanding to 3,000 positions
- Strategic expansion of advanced packaging capacity starting 2027
- Flexibility to adjust HBM and NAND capacity based on market demand
- Significant capital expenditure requiring long-term return justification
- Operations won't begin until 2026, with meaningful capacity expansion in 2027
Insights
The
The Singapore location offers significant advantages: established semiconductor ecosystem, skilled workforce and strategic proximity to key Asian markets. The 3,000 planned jobs signal long-term commitment and will create valuable technical expertise in the region. The facility's dual-purpose capability for both HBM and NAND manufacturing provides important operational flexibility to adjust to market demands.
Most crucially, this positions Micron to capture a larger share of the rapidly growing AI memory market, currently dominated by SK Hynix and Samsung. The timing is strategic as AI infrastructure buildout accelerates globally.
The advanced packaging facility's technical specifications are particularly noteworthy. Integration of AI-based automation systems and LEED certification requirements indicates a state-of-the-art manufacturing approach that will likely yield superior quality control and operational efficiency. The greenhouse gas abatement and water recycling systems demonstrate forward-thinking sustainability integration that could reduce long-term operational costs.
The facility's location adjacent to existing operations creates valuable synergies in logistics and operational management. The planned automation level suggests significantly higher margins compared to traditional packaging facilities, with potential yield improvements of
This investment significantly strengthens Micron's competitive position in the high-margin HBM market. The timing is particularly strategic given the projected
The phased investment approach through 2030 helps manage capital allocation efficiently while maintaining strong balance sheet health. Expected return on investment should materialize by 2027-2028, coinciding with peak AI infrastructure buildout. This positions Micron to potentially capture
Approximate
SINGAPORE, Jan. 08, 2025 (GLOBE NEWSWIRE) -- Micron Technology, Inc. (Nasdaq: MU) broke ground today on a new High-Bandwidth Memory (HBM) advanced packaging facility adjacent to the company鈥檚 current facilities in Singapore. Micron marked the occasion with a ceremony attended by Gan Kim Yong, Deputy Prime Minister and Minister for Trade and Industry of Singapore, Png Cheong Boon, Chairman of the Singapore Economic Development Board, Pee Beng Kong, Executive Vice President of the Singapore Economic Development Board, and Tan Boon Khai, CEO of JTC Corporation.
The new HBM advanced packaging facility will be the first facility of its kind in Singapore. Operations for the new facility are scheduled to begin in 2026, with meaningful expansion of Micron鈥檚 total advanced packaging capacity beginning in calendar 2027 to meet the demands of AI growth. The launch of this facility will further strengthen Singapore鈥檚 local semiconductor ecosystem and innovation.
鈥淎s AI adoption proliferates across industries, the demand for advanced memory and storage solutions will continue to increase robustly,鈥� said Sanjay Mehrotra, president and CEO of Micron. 鈥淲ith the continued support of the Singapore government, our investment in this HBM advanced packaging facility strengthens our position to address the expanding AI opportunities ahead.鈥�
Micron鈥檚 HBM advanced packaging investment of approximately US
Png Cheong Boon, Chairman of the Singapore Economic Development Board, said, 鈥淲e welcome this significant investment by Micron, which reflects its confidence in Singapore鈥檚 competitiveness as a critical node in the global semiconductor supply chain. This is Singapore鈥檚 first high-bandwidth memory advanced packaging facility, allowing us to contribute to global AI growth. It expands Singapore鈥檚 partnership with Micron and further strengthens the semiconductor ecosystem in Singapore.鈥�
Micron鈥檚 future expansion plans in Singapore will also support long-term manufacturing requirements for NAND.
Micron will maintain flexibility in managing the pace of capacity ramps in both the HBM and NAND facilities to align with market demand.听听听
Micron鈥檚 current facility in Singapore is the first front-end semiconductor fab in the world to be recognized as the Advanced Fourth Industrial Revolution Lighthouse and Sustainability Lighthouse by the World Economic Forum. The new HBM advanced packaging facility will be built in alignment with Micron鈥檚 sustainability commitments. It will feature technologies such as a greenhouse gas abatement, water recycling and waste circularity (reduce, reuse, recycle, recover).听The new building will be highly automated through AI-based intelligent solutions and designed to meet the Leadership in Energy and Environmental Design (LEED) certification requirements.听
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all. With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND and NOR memory and storage products through our Micron庐 and Crucial庐 brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence (AI) and compute-intensive applications that unleash opportunities 鈥� from the data center to the intelligent edge and across the client and mobile user experience. To learn more about Micron Technology, Inc. (Nasdaq: MU), visit micron.com.
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